The Commerce Department will award up to $6.6 billion in funding to Taiwan Semiconductor Manufacturing Company under the Chips Act to help the leading semiconductor manufacturing firm build fabs in Arizona, the agency announced April 8. Commerce said it signed a “non-binding preliminary memorandum of terms” with TSMC for the funding, which will help it build two previously announced fabs in Phoenix (see 2005150033) and an additional third fab before the end of the decade.
The Commerce Department this week announced plans to provide about $20 billion in funding and loans to Intel under the Chips Act, which it said will “strengthen” the U.S. semiconductor supply chain by ensuring more leading-edge logic chips are made in America. Commerce said Intel expects to invest more than $100 billion over the next five years to set up new chip fabs and other facilities in Arizona, New Mexico, Ohio and Oregon, and coupled with Chips Act funding, that “would mark one of the largest investments ever announced in U.S. semiconductor manufacturing.”
A trade association representing ASML, Applied Materials and other major semiconductor companies called on the EU to keep any new export controls narrowly targeted and abandon its plans for an outbound investment screening mechanism, saying new restrictions would be a “major interference” for the chip industry. It also cautioned European lawmakers about introducing new supply chain reporting obligations that would place too big a burden on industry.
Most companies applying for funding under the Chips Act (see 2309220035 and 2306280038) aren’t going to get the money they want, Commerce Secretary Gina Raimondo said this week. The agency has gotten more than 600 “statements of interest” from semiconductor companies, she said, and Commerce has had to have “tough conversations” with those businesses about what kind of funding they can realistically expect.
The U.S. and the EU held the fifth meeting of the U.S.-EU Trade and Technology Council in Washington on Jan. 30, where the two sides again committed to increasing trade and cooperating on economic security and emerging technology issues, according to a European Commission readout of the meeting. The commission said the EU and the U.S. agreed to “explore ways to facilitate trade in goods and technologies that are vital for the green transition” and strengthen approaches to investment screening, export controls, outbound investment and “dual-use innovation.”
The Commerce Department plans to announce a “department-wide” strategy in the “weeks ahead” that will address its major priorities in national security, Deputy Commerce Secretary Don Graves said on Jan. 9.
The Commerce Department announced on Jan. 4 that it has agreed to provide about $162 million to Microchip Technology under the Chips Act to nearly triple semiconductor production at the company’s facilities in Colorado Springs, Colorado, and Gresham, Oregon.
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