Xperi's Adeia Brand Announces Pact With Lapis for Hybrid Bonding IP
Xperi’s intellectural property licensing brand, Adeia, announced an agreement transferring its DBI Ultra die-to-wafer hybrid bonding IP to Rohm semiconductor company Lapis. The agreement also includes a license to Adeia’s foundational hybrid bonding patent portfolio, the companies said Wednesday. Lapis…
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will use the technology in a new generation of application specific standard products and custom large scale integration and application specific integrated circuits, they said.