Qualcomm, TDK To Form Joint Venture for Delivery of RFFE Modules and Filters in Integrated Systems
Qualcomm and TDK are forming a joint venture for delivery of RF front-end (RFFE) modules and RF filters into integrated systems for mobile and IoT devices, drones, robotics and automotive applications, they said Wednesday. Called RF360 Holdings Singapore, the venture…
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will draw on TDK’s capabilities in micro-acoustic RF filtering, packaging and module integration and Qualcomm’s wireless technologies expertise, said the companies. Qualcomm and TDK will expand their collaboration on sensors and wireless charging, they said. Growing demands in mobile communications require current and future smartphones to support dozens of frequency bands for 2G, 3G, 4G LTE and 5G, along with connectivity for wireless LAN, satellite navigation and Bluetooth. In addition, the convergence of 4G mobile communications and the IoT means device makers must achieve “new levels of miniaturization, integration and performance, especially for the RFFE,” said the companies. Module solutions will be essential to supporting increasing complexity in the RFFE and RF360 and Qualcomm Technologies will be well positioned to design products from the modem/transceiver to the antenna in a “fully integrated system,” they said. RF360 Holdings will initially be owned 51 percent by Qualcomm Global Trading and 49 percent by TDK subsidiary Epcos. Under the agreement, filter and module design and manufacturing assets, plus related patents, will be carved out from TDK and its subsidiaries and be largely acquired by RF360 Holdings, with certain assets being acquired directly by Qualcomm affiliates, said the companies. The aggregate transaction value is expected to be about $3 billion. The agreement, subject to regulatory approvals and other closing conditions, is expected to close by early 2017.